SMT Technology Engineer

Description

DRS RADA Technologies, a leading defense company developing and manufacturing life-saving radar systems is seeking an SMT Technology Engineer to join the Manufacturing Engineering Department at its Beit She’an facility. The role focuses on supporting existing products and transferring NPI (New Product Introduction) products from Development to Manufacturing. The position includes support for highly complex electronic assemblies and technical support for SMT subcontractors.

Key Responsibilities:

• Provide engineering support for all electronic assemblies throughout the product lifecycle.
• Troubleshoot issues related to electronic boards, including quality issues, manufacturing challenges at subcontractors, obsolete component replacement, and identification of suitable alternative components.
• Perform failure analysis, investigate technical issues through to resolution, and provide immediate support during critical engineering issues affecting production or customer deliveries.
• Lead engineering projects and manufacturing-focused initiatives, including failure analysis, cost reduction, yield improvement, and other continuous improvement activities.
• Plan and execute engineering experiments to support root cause investigations and validate design changes to electronic assemblies.
• Support NPI products and establish manufacturing infrastructure for serial production.
• Provide technical support for PCB manufacturing and assembly processes at SMT subcontractors for both existing products and NPI programs.
• Support and review Design for Manufacturing (DFM) processes for electronic assemblies.

Requirements

• B.Sc. in Electronic/Mechanical/Materials Engineering – Required.
• Experience in the defense industry – Advantage.
• Strong troubleshooting capabilities for electronic assemblies, including digital, RF, and power electronics.
• Previous experience as an SMT Process Technologist/Engineer at an EMS (Electronics Manufacturing Services) company – Significant advantage.
• 5–8 years of experience transferring multidisciplinary products from development to manufacturing.
• Deep understanding of PCB manufacturing and assembly processes, including PCB fabrication, SMT assembly, and production troubleshooting.
• Proven experience leading engineering projects within Engineering or R&D organizations, including PCB design reviews, process analysis, and implementation of engineering improvements.
• Knowledge of DFA (Design for Assembly) and DFM (Design for Manufacturing) methodologies for electronic assemblies.
• Strong understanding of engineering processes such as NPI, FAI (First Article Inspection), ECO (Engineering Change Order), and related processes.
• In-depth knowledge of laboratory testing and validation methods, including metallographic cross-sections, Dye & Pry, and Strain Gauge testing.
• Knowledge of military standards (MIL) for product qualification and manufacturing processes – Advantage.
• Experience with configuration management and enterprise systems such as PLM and Priority ERP – Advantage.
• Excellent presentation skills, including the ability to present engineering processes, failure investigations, and technical analysis reports.
• Fluent Hebrew and English, both written and spoken.
• Willingness to travel internationally on a frequent basis.